Tummala R Fundamentals of Microsystems Packaging 2000 torrent

Textbook in PDF format

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:
Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
Easy-to-read schematics and block diagrams
Fundamental approaches to all system issues
Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
Basics of electrical and reliability testing