Li Y 3D Microelectronic Packaging From Architect App 2ed 2021 torrent

Textbook in PDF format

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
Introduction to 3D Microelectronic Packaging
3D Packaging Architectures and Assembly Process Design
Materials and Processing of TSV
Microstructure and Mechanical Reliability Issues of TSV
Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV
Atomic Scale Kinetics of TSV Protrusion
Fundamentals and Failures in Die Preparation for 3D Packaging
Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging
Copper Micro and Nano Particles Mixture for 3D Interconnection Application
Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages
Fundamentals of Solder Alloys in 3D Packaging
Fundamentals of Electromigration in Interconnects of 3D Packaging
Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design
Fundamentals of Advanced Materials and Processes in Organic Substrate Technology
Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
Processing and Reliability of Solder Interconnections in Stacked Packaging
Interconnect Quality and Reliability of 3D Packaging
Fault Isolation and Failure Analysis of 3D Packaging